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Our
surface mount capability has been
configured to serve our core
business of small to medium volume
orders where the ability to change
quickly between board
configurations is as essential as
component placement speed.
Components from 0402 to 20 mil
pitch (including BGA's) can be
placed using on-the-fly video
placement correction for all
components. This means that as
each component is picked up it is
immediately checked for package
type and orientation using a high
resolution camera and frame grab
system mounted in the placement
head. A separate fixed camera
provides additional information
for larger devices.
These
techniques offer advantages over
mechanically centred systems in
terms of both placement accuracy
and the safe handling of fragile
components.
The
system is controlled by a
dedicated PC running Windows™
based software and allows several
methods of data entry. Programming
can be carried out off-line thus
allowing a new job to be set up
whilst the current job is being
run on the machine.
The
graphics based software can
directly read Gerber photoplot
data produced by any cad system.
This allows extremely fast and
accurate programming of board and
component data regardless of the
cad package used to create the
design.
Alternatively,
any CAD ASCII file containing
placement information can be
imported. This allows full
flexibility for subsequent
modifications to layout or
components. Bill of materials
information can be imported in any
format.
The
pick and place machines are
supported by an infra red reflow
oven incorporating Windows™
software
running on a dedicated PC. The
oven features auto calibration and
fault monitoring whilst heating
profiles can be set for individual
board types and the data stored
for use on future batches of the
same board. |